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• Integrated Single Channel Load Switch |
• Input Voltage Range: 0.8 V to 5.7 V |
• Ultra-Low On Resistance (RON)
– RON = 16 mΩ at VIN = 5 V (VBIAS = 5 V)
– RON = 16 mΩ at VIN = 3.6 V (VBIAS = 5 V)
– RON = 16 mΩ at VIN = 1.8 V (VBIAS = 5 V)
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• 6-A Maximum Continuous Switch Current |
• Low Quiescent Current (50 µA) |
• Low Control Input Threshold Enables Use of
1.2-, 1.8-, 2.5-, and 3.3-V Logic |
• Configurable Rise Time |
• Quick Output Discharge (QOD) (Optional) |
• SON 8-pin Package With Thermal Pad |
• ESD Performance Tested per JESD 22
– 2000-V HBM and 1000-V CDM |
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CATALOG |
TPS22965DSGR COUNTRY OF ORIGIN |
TPS22965DSGR PARAMETRIC INFO |
TPS22965DSGR PACKAGE INFO |
TPS22965DSGR MANUFACTURING INFO |
TPS22965DSGR PACKAGING INFO |
TPS22965DSGR ECAD MODELS |
TPS22965DSGR FUNCTIONAL BLOCK DIAGRAM |
TPS22965DSGR APPLICATIONS |
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COUNTRY OF ORIGIN |
China |
Costa Rica |
Japan |
Philippines |
Thailand |
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PARAMETRIC INFO |
Enable Logic |
Active High |
Type |
High Side |
Number of Outputs |
1 |
Maximum Output Current (A) |
6 |
Maximum Input Voltage (V) |
5.7 |
Number of Inputs |
1 |
Minimum Operating Temperature (°C) |
-40 |
Output Type |
N-Channel |
Minimum Input Voltage (V) |
0.8 |
Maximum Operating Temperature (°C) |
105 |
Number of Switches |
1 |
Input Type |
Non-Inverting |
Switch On Resistance (Ohm) |
0.016 |
Output Voltage Range (V) |
-0.3 to 6 |
Operating Supply Voltage Range (V) |
2.5 to 5.7 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO |
Supplier Package |
WSON EP |
Basic Package Type |
Non-Lead-Frame SMT |
Pin Count |
8 |
Lead Shape |
No Lead |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
0.5 |
Package Length (mm) |
2.1(Max) |
Package Width (mm) |
2.1(Max) |
Package Height (mm) |
0.75(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
2.1(Max) |
Package Overall Width (mm) |
2.1(Max) |
Package Overall Height (mm) |
0.8(Max) |
Seated Plane Height (mm) |
0.8(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Very Very Thin Small Outline No Lead Package, Exposed Pad |
Package Family Name |
SON |
Jedec |
MO-229 |
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MANUFACTURING INFO |
MSL |
2 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
Number of Wave Cycles |
N/R |
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PACKAGING INFO |
Packaging Suffix |
R |
Packaging |
Tape and Reel |
Quantity Of Packaging |
3000 |
Reel Diameter (in) |
7.09 |
Reel Width (mm) |
8.4 |
Tape Pitch (mm) |
4 |
Tape Width (mm) |
8 |
Component Orientation |
Q2 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS |
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FUNCTIONAL BLOCK DIAGRAM |
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APPLICATIONS |
• Ultrabook™
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• Notebooks and Netbooks |
• Tablet PC |
• Consumer Electronics |
• Set-top Boxes and Residential Gateways |
• Telecom Systems |
• Solid State Drives (SSDs) |
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