TMS320F28069MPZT Texas Instruments IC MCU 32BIT 256KB FLASH 100LQFP

label:

2024/01/11 98

• High-efficiency 32-bit CPU (TMS320C28x)
– 90 MHz (11.11-ns cycle time)
– 16 × 16 and 32 × 32 Multiply and Accumulate (MAC) operations
– 16 × 16 dual MAC
– Harvard bus architecture
– Atomic operations
– Fast interrupt response and processing
– Unified memory programming model
– Code-efficient (in C/C++ and Assembly)

• Floating-Point Unit (FPU)
– Native single-precision floating-point operations

• Programmable Control Law Accelerator (CLA)
– 32-bit floating-point math accelerator
– Executes code independently of the main CPU

• Viterbi, Complex Math, CRC Unit (VCU)
– Extends C28x instruction set to support complex multiply, Viterbi operations, and Cyclic Redundency Check (CRC)

• Embedded memory
– Up to 256KB of flash
– Up to 100KB of RAM
– 2KB of One-Time Programmable (OTP) ROM

• 6-channel Direct Memory Access (DMA)

• Low device and system cost
– Single 3.3-V supply
– No power sequencing requirement
– Integrated power-on reset and brownout reset
– Low-power operating modes
– No analog support pin

• Endianness: Little endian

• JTAG boundary scan support
– IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture

• Clocking
– Two internal zero-pin oscillators
– On-chip crystal oscillator/external clock input
– Watchdog timer module
– Missing clock detection circuitry

• Peripheral Interrupt Expansion (PIE) block that supports all peripheral interrupts

• Three 32-bit CPU timers

• Advanced control peripherals

• Up to 8 Enhanced Pulse-Width Modulator (ePWM) modules
– 16 PWM channels total (8 HRPWM-capable)
– Independent 16-bit timer in each module

• Three input Enhanced Capture (eCAP) modules

• Up to 4 High-Resolution Capture (HRCAP) modules

• Up to 2 Enhanced Quadrature Encoder Pulse (eQEP) modules

• 12-bit Analog-to-Digital Converter (ADC), dual Sample-and-Hold (S/H)
– Up to 3.46 MSPS
– Up to 16 channels

• On-chip temperature sensor

• 128-bit security key and lock
– Protects secure memory blocks
– Prevents reverse-engineering of firmware

• Serial port peripherals
– Two Serial Communications Interface (SCI) [UART] modules
– Two Serial Peripheral Interface (SPI) modules
– One Inter-Integrated-Circuit (I2C) bus
– One Multichannel Buffered Serial Port (McBSP) bus
– One Enhanced Controller Area Network (eCAN)
– Universal Serial Bus (USB) 2.0 (see Device Comparison for availability)
• Full-speed device mode
• Full-speed or low-speed host mode

• Up to 54 individually programmable, multiplexed General-Purpose Input/Output (GPIO) pins with input filtering

• Advanced debug features
– Analysis and breakpoint functions
– Real-time debug through hardware

• Package options
– 80-pin PFP and 100-pin PZP PowerPAD™ Thermally Enhanced Thin Quad Flatpacks (HTQFPs)
– 80-pin PN and 100-pin PZ Low-Profile Quad Flatpacks (LQFPs)

• Temperature options
– T: –40°C to 105°C
– S: –40°C to 125°C
– Q: –40°C to 125°C (AEC Q100 qualification for automotive applications)

CATALOG

TMS320F28069MPZT COUNTRY OF ORIGIN

TMS320F28069MPZT PARAMETRIC INFO

TMS320F28069MPZT PACKAGE INFO

TMS320F28069MPZT MANUFACTURING INFO

TMS320F28069MPZT PACKAGING INFO

TMS320F28069MPZT ECAD MODELS

TMS320F28069MPZT FUNCTIONAL BLOCK DIAGRAM

TMS320F28069MPZT APPLICATIONS

COUNTRY OF ORIGIN

Philippines

PARAMETRIC INFO

Data Bus Width (bit)	32
Family Name	C2000
Device Core	C28x
Instruction Set Architecture	RISC
Maximum Clock Rate (MHz)	90
Program Memory Type	Flash
Program Memory Size	256KB
RAM Size	100KB
Maximum CPU Frequency (MHz)	90
Number of Programmable I/Os	54
Number of Timers	3
ADC Channels	16
ADC Resolution (bit)	12
Number of ADCs	Single
Core Architecture	C28x
Number of DACs	Triple
PWM	16
Watchdog	1
Analog Comparators	3
Special Features	CAN Controller
Interface Type	CAN/I2C/SCI/SPI/UART/USB
Programmability	Yes
SPI	2
I2C	1
I2S	0
UART	2
USART	0
CAN	1
USB	1
Ethernet	0
Minimum Operating Supply Voltage (V)	2.97
Typical Operating Supply Voltage (V)	3.3
Maximum Operating Supply Voltage (V)	3.63
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	105
Temperature Flag	Opr
Operating Supply Voltage (V)	3.3
Maximum Storage Temperature (°C)	150
Minimum Storage Temperature (°C)	-65

PACKAGE INFO

Supplier Package	LQFP
Basic Package Type	Lead-Frame SMT
Pin Count	100
Lead Shape	Gull-wing
PCB	100
Tab	N/R
Pin Pitch (mm)	0.5
Package Length (mm)	14.2(Max)
Package Width (mm)	14.2(Max)
Package Height (mm)	1.45(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	16.2(Max)
Package Overall Width (mm)	16.2(Max)
Package Overall Height (mm)	1.6(Max)
Seated Plane Height (mm)	1.6(Max)
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Low Profile Quad Flat Package
Package Family Name	QFP
Jedec	MS-026

MANUFACTURING INFO

MSL	3
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	J-STD-020D
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Au
Under Plating Material	Pd over Ni
Terminal Base Material	Cu Alloy