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• nanoPOWER:– OPA369: 800nA – OPA2369: 700nA/ch.
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• LOW OFFSET VOLTAGE: 250µV – ZERO-CROSSOVER
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• LOW OFFSET DRIFT: 0.4µV/°C
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| • PRECISION:– CMRR: 114dB– PSRR:106dB– AOL: 134dB
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| • GAIN-BANDWIDTH PRODUCT: 12kHz |
| • SUPPLY VOLTAGE: 1.8V to 5.5V |
| • microSIZE PACKAGES – SC70-5, SOT23-5, MSOP-8 |
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| CATALOG |
| OPA2369AIDGKT COUNTRY OF ORIGIN |
OPA2369AIDGKT PARAMETRIC INFO
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OPA2369AIDGKT PACKAGE INFO
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OPA2369AIDGKT MANUFACTURING INFO
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OPA2369AIDGKT PACKAGING INFO
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OPA2369AIDGKT ECAD MODELS
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| OPA2369AIDGKT APPLICATIONS |
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| COUNTRY OF ORIGIN |
| Malaysia |
| Thailand |
| Taiwan (Province of China) |
| China |
|
PARAMETRIC INFO
|
| Manufacturer Type |
Low Power Amplifier |
| type |
Low Power Amplifier |
| Rail to Rail |
Rail to Rail Input/Output |
| Minimum Single Supply Voltage (V) |
1.8 |
| Number of Channels per Chip |
2 |
| Minimum PSRR (dB) |
106.02(Typ) |
| Typical Single Supply Voltage (V) |
3|5 |
| Maximum Single Supply Voltage (V) |
5.5 |
| Typical Gain Bandwidth Product (MHz) |
0.012 |
| Maximum Input Offset Voltage (mV) |
0.75@5.5V |
| Maximum Input Offset Current (uA) |
0.00005@5.5V |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Maximum Input Bias Current (uA) |
0.00005@5.5V |
| Minimum CMRR (dB) |
100 |
| Maximum Supply Voltage Range (V) |
5.5 to 6 |
| Minimum CMRR Range (dB) |
95 to 105 |
| Typical Voltage Gain (dB) |
134 |
| Typical Slew Rate (V/us) |
0.005@5.5V |
| Typical Input Noise Voltage Density (nV/rtHz) |
290@5.5V |
| Typical Noninverting Input Current Noise Density (pA/rtHz) |
0.001@5.5V |
| Shut Down Support |
no |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Power Supply Type |
Single |
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PACKAGE INFO
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| Supplier packaging |
VSSOP |
| Basic package type |
Lead-Frame SMT |
| Number of pins |
8 |
| Pin shape |
Gull-wing |
| PCB |
8 |
| ears |
N/R |
| Pin spacing (mm) |
0.65 |
| Package length (mm) |
3.1(Max) |
| Package width (mm) |
3.1(Max) |
| Package height (mm) |
0.95(Max) |
| Package diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.1(Max) |
| Package Overall Width (mm) |
5.05(Max) |
| Package Overall Height (mm) |
1.1(Max) |
| Mounting surface height (mm) |
1.1(Max) |
| Install |
Surface Mount |
| Package weight (g) |
not applicable |
| Packaging materials |
Plastic |
| package instruction |
Very Thin Shrink Small Outline Package |
| Package series name |
SO |
| JEDEC |
MO-187AA |
| Package outline |
Link to datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
2 |
| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
30 |
| Number of reflow cycles |
3 |
| standard |
J-STD-020D |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Lead Finish(Plating) |
Au|AuAg |
| Plating materials |
Pd over Ni |
| Terminal Base Material |
N/A|Cu Alloy |
|
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PACKAGING INFO
|
| Packaging Suffix |
T |
| Package |
Tape and reel packaging |
| Packing quantity |
250 |
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ECAD MODELS
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APPLICATIONS
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• BATTERY-POWERED INSTRUMENTS
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| • PORTABLE DEVICES |
| • MEDICAL INSTRUMENTS |
• TEST EQUIPMENT
|
| • LOW-POWER SENSOR SIGNAL CONDITIONING |
| |
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