OPA2350UA Texas Instruments IC OPAMP GP 38MHZ RRO 8SOIC

label:
2023/12/14 91


• Rail-to-Rail Input  
• Rail-to-Rail Output (Within 10 mV)
• Wide Bandwidth: 38 MHz
• High Slew Rate: 22 V/μs
• Low Noise: 5 nV/√Hz
• Low THD+Noise: 0.0006%
• Unity-Gain Stable  
• MicroSize Packages
• Single, Dual, and Quad


CATALOG
OPA2350UA Country of Origin
OPA2350UA Parametric Info
OPA2350UA Package Info  
OPA2350UA Manufacturing Info
OPA2350UA Packaging Info
OPA2350UA ECAD Models
OPA2350UA Functional Block Diagram
OPA2350UA Applications


COUNTRY OF ORIGIN
Philippines
Taiwan (Province of China)
Thailand
China
Japan
Malaysia


PARAMETRIC INFO
Manufacturer Type Precision Amplifier
Type Precision Amplifier
Rail to Rail Rail to Rail Input/Output
Minimum Single Supply Voltage (V) 2.7
Number of Channels per Chip 2
Process Technology 0.6 micron CMOS
Minimum PSRR (dB) 87.96(Typ)
Typical Single Supply Voltage (V) 5
Maximum Single Supply Voltage (V) 5.5
Output Type CMOS
Maximum Quiescent Current (mA) 15@5.5V
Minimum Dual Supply Voltage (V) ±1.35
Typical Gain Bandwidth Product (MHz) 38
Maximum Input Offset Voltage (mV) 0.5@5V
Typical Dual Supply Voltage (V) ±2.5
Maximum Input Offset Current (uA) 0.00001@5.5V
Maximum Dual Supply Voltage (V) ±2.75
Maximum Operating Supply Voltage (V) ±2.75|5.5
Maximum Input Bias Current (uA) 0.00001@5.5V
Minimum CMRR (dB) 66
Maximum Supply Voltage Range (V) 5.5 to 6
Minimum CMRR Range (dB) 65 to 70
Typical Voltage Gain (dB) 122
Typical Slew Rate (V/us) 22@5V
Typical Input Offset Current (uA) 0.0000005@5V
Typical Settling Time (ns) 500
Typical Output Current (mA) 40@5V
Typical Input Noise Voltage Density (nV/rtHz) 7@5V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.004@5V
Typical Input Bias Current (uA) 0.0000005@5V
Shut Down Support No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Power Supply Type Single|Dual
 
PACKAGE INFO
Supplier Package SOIC
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5(Max)
Package Width (mm) 3.98(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5(Max)
Package Overall Width (mm) 6.19(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet
 
MANUFACTURING INFO
MSL 2
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R
 
PACKAGING INFO
Packaging Tube
Quantity Of Packaging 75
Packaging Document Link to Datasheet
 
ECAD MODELS


FUNCTIONAL BLOCK DIAGRAM

 
APPLICATIONS
• Cell Phone PA Control Loops
• Driving A/D Converters  
• Video Processing  
• Data Acquisition
• Process Controls
• Audio Processing
• Communications
• Active Filters
• Test Equipment
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