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|
• RoHS compliant |
• Data transmission at signal rates of 1 to 125 Mbaud
over distances of 100 meters |
• Compatible with inexpensive, easily terminated plastic
optical fiber, and with large-core silica fiber |
• High voltage isolation |
• Transmitter and receiver application circuit schematics
and recommended board layouts available |
• Interlocking feature for single-channel or duplex links, in
a vertical or horizontal mount configuration |
|
CATALOG |
HFBR-2526Z COUNTRY OF ORIGIN
|
HFBR-2526Z LIFECYCLE |
HFBR-2526Z PARAMETRIC INFO |
HFBR-2526Z PACKAGE INFO |
HFBR-2526Z MANUFACTURING INFO |
HFBR-2526Z ECAD MODELS |
HFBR-2526Z APPLICATIONS |
|
COUNTRY OF ORIGIN |
Philippines |
|
LIFECYCLE |
Obsolete
Jun 30,2023 |
|
PARAMETRIC INFO |
Type |
RX |
Maximum Data Rate |
125MBd |
Average Optical Output Power (dBm) |
-9.7(Typ) |
Emitter Type |
LED |
Peak Wavelength (nm) |
650 |
Rise Time (ns) |
6.3 |
Maximum Fall Time (ns) |
6.3 |
Maximum Forward Current (mA) |
60 |
Maximum Output Current (mA) |
25 |
Minimum Operating Supply Voltage (V) |
-0.5 |
Typical Operating Supply Voltage (V) |
1.8|2.5|3.3|5 |
Maximum Operating Supply Voltage (V) |
6 |
Minimum Operating Temperature (°C) |
0 |
Maximum Operating Temperature (°C) |
70 |
Maximum Distance (m) |
100 |
Operating Supply Voltage (V) |
-0.5 to 6 |
Maximum Storage Temperature (°C) |
85 |
Minimum Storage Temperature (°C) |
-40 |
|
|
PACKAGE INFO |
Supplier Package |
N/A |
Pin Count |
6 |
PCB |
6 |
Tab |
N/R |
Package Length (mm) |
N/A |
Package Width (mm) |
N/A |
Package Height (mm) |
N/A |
Package Diameter (mm) |
N/R |
Mounting |
Through Hole |
Package Weight (g) |
N/A |
Package Description |
N/A |
Package Family Name |
N/A |
Jedec |
N/A |
|
|
MANUFACTURING INFO |
MSL |
4 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
N/A |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
260 |
Wave Solder Time (Sec) |
10 |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
N/A |
|
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ECAD MODELS |
|
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APPLICATIONS |
• Intrasystem links: board-to-board, rack-to-rack |
• Telecommunications switching systems |
• Computer-to-peripheral data links, PC bus extension |
• Industrial control |
• Proprietary LANs |
• Digitized video |
• Medical instruments |
• Reduction of lightning and voltage transient
susceptibility |
|