VND5012AKTR-E STMicroelectronics IC DRVR HISIDE 2CH POWERSSO24

label:
2023/09/15 21


■ General features
   – Inrush current active management by power limitation
   – Very low standby current
   – 3.0 V CMOS compatible input
   – Optimized electromagnetic emission
   – Very low electromagnetic susceptibility
   – In compliance with the 2002/95/EC european directive
■ Diagnostic functions
   – Proportional load current sense
   – High current sense precision for wide range currents
   – Current sense disable
   – Thermal shutdown indication
   – Very low current sense leakage
■ Protections
   – Undervoltage shutdown
   – Overvoltage clamp
   – Output stuck to Vcc detection
   – Load current limitation
   – Self limiting of fast thermal transients
   – Protection against loss of ground and loss of VCC
   – Thermal shutdown


CATALOG
VND5012AKTR-E COUNTRY OF ORIGIN  
VND5012AKTR-E PARAMETRIC INFO
VND5012AKTR-E PACKAGE INFO
VND5012AKTR-E MANUFACTURING INFO
VND5012AKTR-E PACKAGING INFO
VND5012AKTR-E ECAD MODELS
VND5012AKTR-E FUNCTONAL BLOCK DIAGRAM
VND5012AKTR-E APPLICATION


COUNTRY OF ORIGIN
Italy
Malaysia
Singapore


PARAMETRIC INFO
Number of Outputs 2
Number of Inputs 2
Maximum Output Current (A) 84
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 150
Switch On Resistance (mOhm) 12(Max)
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
 

PACKAGE INFO
Supplier Package PowerSSO EP
Basic Package Type Lead-Frame SMT
Pin Count 24
Lead Shape Gull-wing
PCB 24
Tab N/R
Pin Pitch (mm) 0.8
Package Length (mm) 10.4(Max)
Package Width (mm) 7.6(Max)
Package Height (mm) 2.15(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 2.22(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Power Shrink Small Outline Package, Exposed Pad
Package Family Name SOP
Jedec N/A
 

MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn
Under Plating Material N/A
Terminal Base Material Cu Alloy
Shelf Life Period 2 Years
 

PACKAGING INFO
Packaging Suffix TR
Packaging Tape and Reel
Quantity Of Packaging 1000
Packaging Document Link to Datasheet
 

ECAD MODELS


FUNCTONAL BLOCK DIAGRAM


APPLICATION
■ All types of resistive, inductive and capacitive loads


Toode RFQ