VND5012AKTR-E STMicroelectronics IC DRVR HISIDE 2CH POWERSSO24

label:

2023/09/15 326

■ General features
– Inrush current active management by power limitation
– Very low standby current
– 3.0 V CMOS compatible input
– Optimized electromagnetic emission
– Very low electromagnetic susceptibility
– In compliance with the 2002/95/EC european directive

■ Diagnostic functions
– Proportional load current sense
– High current sense precision for wide range currents
– Current sense disable
– Thermal shutdown indication
– Very low current sense leakage

■ Protections
– Undervoltage shutdown
– Overvoltage clamp
– Output stuck to Vcc detection
– Load current limitation
– Self limiting of fast thermal transients
– Protection against loss of ground and loss of VCC
– Thermal shutdown

CATALOG

VND5012AKTR-E COUNTRY OF ORIGIN

VND5012AKTR-E PARAMETRIC INFO

VND5012AKTR-E PACKAGE INFO

VND5012AKTR-E MANUFACTURING INFO

VND5012AKTR-E PACKAGING INFO

VND5012AKTR-E ECAD MODELS

VND5012AKTR-E FUNCTONAL BLOCK DIAGRAM

VND5012AKTR-E APPLICATION

COUNTRY OF ORIGIN

Italy

Malaysia

Singapore

PARAMETRIC INFO

Number of Outputs	2
Number of Inputs	2
Maximum Output Current (A)	84
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	150
Switch On Resistance (mOhm)	12(Max)
Minimum Storage Temperature (°C)	-55
Maximum Storage Temperature (°C)	150

PACKAGE INFO

Supplier Package	PowerSSO EP
Basic Package Type	Lead-Frame SMT
Pin Count	24
Lead Shape	Gull-wing
PCB	24
Tab	N/R
Pin Pitch (mm)	0.8
Package Length (mm)	10.4(Max)
Package Width (mm)	7.6(Max)
Package Height (mm)	2.15(Max)
Package Diameter (mm)	N/R
Seated Plane Height (mm)	2.22(Max)
Mounting	Surface Mount
Package Material	Plastic
Package Description	Power Shrink Small Outline Package, Exposed Pad
Package Family Name	SOP
Jedec	N/A

MANUFACTURING INFO

MSL	3
Maximum Reflow Temperature (°C)	260
Number of Reflow Cycle	3
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Matte Sn
Under Plating Material	N/A
Terminal Base Material	Cu Alloy
Shelf Life Period	2 Years

PACKAGING INFO

Packaging Suffix	TR
Packaging	Tape and Reel
Quantity Of Packaging	1000
Packaging Document	Link to Datasheet

ECAD MODELS

FUNCTONAL BLOCK DIAGRAM

APPLICATION

■ All types of resistive, inductive and capacitive loads