MK22FN512VDC12 NXP Semiconductors IC MCU 32BIT 512KB FLASH 121BGA

label:
2023/11/20 254


CATALOG
MK22FN512VDC12 COUNTRY OF ORIGIN
MK22FN512VDC12 PARAMETRIC INFO
MK22FN512VDC12 PACKAGE INFO
MK22FN512VDC12 MANUFACTURING INFO
MK22FN512VDC12 PACKAGING INFO
MK22FN512VDC12 ECAD MODELS


COUNTRY OF ORIGIN
China


PARAMETRIC INFO
Data Bus Width (bit) 32
Family Name K22
Device Core ARM Cortex M4
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 120
Program Memory Type Flash
Program Memory Size 512KB
RAM Size 128KB
Maximum Dhrystone MIPS (MIPS) 1.25
DMA Channels 16
Direct Memory Access Yes
Floating Point Unit No
Bluetooth No
Wi-Fi No
Multiply Accumulate No
Internal/External Clock Type External
Touch Sensing Interface No
Power On Reset No
Memory Protection Unit No
Temperature Sensor No
DDR No
Memory Management Unit No
Integrated Development Environment No
Super Scalar No
External Bus Interface No
Maximum CPU Frequency (MHz) 120
Number of Programmable I/Os 81
Number of Timers 7
ADC Channels 38
ADC Resolution (bit) 16/16
DAC Channels 2
Core Architecture ARM
Number of ADCs Dual
DAC Resolution (bit) 12/12
Number of DACs Dual
PWM 2
Watchdog 2
Analog Comparators 2
Parallel Master Port No
Real Time Clock Yes
Interface Type I2C/I2S/SPI/UART/USB
Programmability Yes
SPI 2
I2C 2
I2S 1
UART 3
USART 0
CAN 0
USB 1
Ethernet 0
Minimum Operating Supply Voltage (V) 1.71
Typical Operating Supply Voltage (V) 2.5|3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 105
Temperature Flag Opr
Operating Supply Voltage (V) 2.5|3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -55
 
PACKAGE INFO
Supplier Package MAP-BGA
Basic Package Type Ball Grid Array
Pin Count 121
Lead Shape Ball
PCB 121
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 8
Package Width (mm) 8
Package Height (mm) 0.41(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 8
Package Overall Width (mm) 8
Package Overall Height (mm) 0.5(Max)
Seated Plane Height (mm) 0.5(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Molded Array Process Ball Grid Array
Package Family Name BGA
Package Outline Link to Datasheet
 
MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 40
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) SnAgCu
Under Plating Material N/A
Terminal Base Material N/A
 
PACKAGING INFO
Packaging Tray
Quantity Of Packaging 348(Min)
Packaging Document Link to Datasheet
 
ECAD MODELS


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