ATSAMV71Q21B-AAB Microchip Technology FLASH

label:
2023/10/17 158



CATALOG
ATSAMV71Q21B-AAB PARAMETRIC INFO
ATSAMV71Q21B-AAB PACKAGE INFO
ATSAMV71Q21B-AAB MANUFACTURING INFO
ATSAMV71Q21B-AAB PACKAGING INFO
ATSAMV71Q21B-AAB ECAD MODELS


PARAMETRIC INFO
Data Bus Width (bit) 32
Family Name SAM V71
Device Core ARM Cortex M7
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 300
Program Memory Type Flash
Program Memory Size 2MB
RAM Size 384KB
Maximum Expanded Memory Size 1MB
DMA Channels 24
Instruction Cache Size 16KB
Data Cache Size 16KB
Direct Memory Access Yes
Floating Point Unit Yes
Bluetooth Yes
Wi-Fi No
Multiply Accumulate No
Internal/External Clock Type Internal/External
Touch Sensing Interface No
Power On Reset No
Memory Protection Unit No
Temperature Sensor Yes
DDR No
Memory Management Unit No
Integrated Development Environment No
Super Scalar No
External Bus Interface No
Maximum CPU Frequency (MHz) 300
Number of Programmable I/Os 114
Number of Timers 4
ADC Channels 24
ADC Resolution (bit) 12
DAC Channels 2
Core Architecture ARM
Number of ADCs Single
DAC Resolution (bit) 12
Number of DACs Single
PWM 2
Watchdog 2
Analog Comparators 1
Parallel Master Port No
Real Time Clock Yes
Special Features CAN Controller
Timers Resolution (bit) 16/16/16/16
Interface Type CAN/Ethernet/I2C/I2S/SPI/UART/USART/USB
Programmability Yes
SPI 6
I2C 3
I2S 2
UART 5
USART 3
CAN 2
USB 1
Ethernet 1
Minimum Operating Supply Voltage (V) 3
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 105
Temperature Flag Opr
Operating Supply Voltage (V) 3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -60


PACKAGE INFO
Supplier Package LQFP
Basic Package Type Lead-Frame SMT
Pin Count 144
Lead Shape Gull-wing
PCB 144
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 20
Package Width (mm) 20
Package Height (mm) 1.4
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.6(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Low Profile Quad Flat Package
Package Family Name QFP
Jedec MS-026BFB
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn
Under Plating Material N/A
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tray
Quantity Of Packaging 60


ECAD MODELS

Toode RFQ